Panel Discussion: “Opportunities and Challenges of Organic Thin-Film Transistors”

Organized by IEEE EDS Organic Electronics Technical Committee

Special Event

The organic thin-film transistor (OTFT) has been regarded as a promising technology for production of lightweight, flexible all-pervasive displays and electronics attributed to its excellent mechanical flexibility, low temperature and fast processing, and compatibility with arbitrary substrates (plastic, paper and fabric). In the last decades, remarkable progresses have been made on development of high mobility soluble organic semiconductors. However, although the claimed mobility in published papers could be as high as several tens of cm²/V^.s, this technology still seems far from being capable for real applications. Overestimation of the material performance by using improper mobility extraction method has also been reported as a serious issue. For further development of the OTFT technology, clear technology and application roadmaps, standard device architecture, processing and characterization methods, efficient and accurate compact models, robust circuit design techniques, and new integration concepts are all important. This panel discussion will try to address these issues, and provide insights of application opportunities and remained challenges for making the OTFT technology towards commercialization.

Panelists will include:

-       World-renowned experts in the related fields of OTFTs

-       Technical and strategy experts from local display & electronics industry

Moderators: 

Xiaojun Guo, Shanghai Jiao Tong University, China

Radu Sporea, University of Surrey, UK

Panelists:

Yunqi Liu, Institute of Chemistry, CAS, China

Simon Ogier, NeuDrive Ltd., UK

Joseph Hsiao, BASF

Yong-Young Noh, Dongguk University, Korea

Ling Li, Institute of Microelectronics, CAS, China

Ahmed Nejim, Silvaco Europe, UK

Mario Caironi, IIT, Italy

Feng Yan, Hong Kong Polytechnic University, China

Tse Nga (Tina) Ng, University of California San Diego, USA

Ta-Ya Chu, National Research Council, Canada

Paul Cain, FlexEnable (formly Plastic Logic), UK

He Lan, Bluuprint, China

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Co-organized by:

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Financial Sponsors: