Panel
Discussion: “Opportunities and Challenges of Organic Thin-Film Transistors”
Organized by IEEE
EDS Organic Electronics Technical Committee
Special Event
The organic thin-film transistor (OTFT) has
been regarded as a promising technology for production of lightweight, flexible
all-pervasive displays and electronics attributed to its excellent mechanical flexibility,
low temperature and fast processing, and compatibility with arbitrary
substrates (plastic, paper and fabric). In the last decades, remarkable
progresses have been made on development of high mobility soluble organic
semiconductors. However, although the claimed mobility in published papers
could be as high as several tens of cm2/V.s, this technology
still seems far from being capable for real applications. Overestimation of the
material performance by using improper mobility extraction method has also been
reported as a serious issue. For further development of the OTFT technology,
clear technology and application roadmaps, standard device architecture,
processing and characterization methods, efficient and accurate compact models,
robust circuit design techniques, and new integration concepts are all important.
This panel discussion will try to address these issues, and provide insights of
application opportunities and remained challenges for making the OTFT technology
towards commercialization.
Panelists
will include:
- World-renowned experts in the related fields of OTFTs
- Technical and strategy experts from local display & electronics industry
Moderators:
Xiaojun Guo, Shanghai Jiao Tong University, China
Radu Sporea, University of Surrey, UK
Panelists:
Yunqi Liu, Institute of Chemistry, CAS, China
Simon Ogier, NeuDrive Ltd., UK
Joseph Hsiao, BASF
Yong-Young Noh, Dongguk University, Korea
Ling Li, Institute of Microelectronics, CAS, China
Ahmed Nejim, Silvaco Europe, UK
Mario Caironi, IIT, Italy
Feng Yan, Hong Kong Polytechnic University, China
Tse Nga (Tina) Ng, University of California San Diego, USA
Ta-Ya Chu, National Research Council, Canada
Paul Cain, FlexEnable (formly Plastic Logic), UK
He Lan, Bluuprint, China
Organized by:
Co-organized by:
Technical Sponsor:
Financial Sponsors: