Submission

Call for Papers
9th International Conference on
Computer Aided Design for Thin-Film Transistor Technologies (CAD-TFT)
Shenzhen, China
November 16-18, 2018

As a fundamental building block of large area electronics, thin-film transistor (TFT) technology has enjoyed an exciting era of research and development in the past decades. Its dominant application-flat panel active matrix display has grown to be a multi-billion-dollar business that keeps growing. In addition to TFTs in amorphous- and polycrystalline-silicon, newly emerging organic, metal oxide and nano-composite semiconductor TFT technologies are becoming increasingly popular. Solution/printing based TFT technologies are also attracting great attention from both academia and industry.

 

These new technologies are needed to meet the growing demands for displays of better quality, lower cost and greener manufacturing, and being thin and flexible. Moreover, the applications of TFTs have been extended from the pixel switching to more complex electronic functions for sensing, imaging, signal communication, processing and data storage on glass, plastic or fabrics substrates, which will enable a lowcost and flexible design solution to usher the age of pervasive electronics, IOTs and artificial intelligence. Therefore, development of computer-aided design (CAD) techniques at all levels becomes more and more critical for the TFT community to bridge the gap between new material/device technologies and implementation of functional systems.

 

IEEE CAD-TFT is the conference dedicated to CAD techniques on TFT technologies for displays, sensors and general large area, flexible and printed electronics. CAD-TFT 2018 follows 2017 CAD-TFT workshop in Cambridge, CAD-TFT 2016 in Beijing, CAD-TFT 2014 in Nanjing, and the previous meetings (International Workshop on Compact Thin-Film Transistor Modeling for Circuit Simulation) held in Cambridge, London, Tarragona, Cambridge and Grenoble. The conference will provide a forum for the TFT community to discuss and address the challenges and seek innovative solutions for modelling of new technology TFTs, TFT device and circuit design and system integration. The areas of interests include, but are not limited to:

●ž Processes and physics of new technology TFTs (metal oxide, organic, nanomaterials, and etc)

●ž Simulation and characterization techniques for TFTs

●ž Characterization and modeling the impact of processes on the device performance

●ž Compact TFT device models for circuit simulation

●ž Model implementation and parameter extraction techniques

●ž Compact models for interconnects in active matrix flat panels

●ž TFT circuit design and analysis techniques

●ž TFT Design for displays and emerging applications

 

Prospective authors should submit a one-page manuscript to cadtft2018@chinatft.org using the given template. Authors of accepted papers will have the opportunity to revise their submissions according to reviewers' comments and submit final versions to be published in the Proceedings and on IEEE Xplore.

 

SUBMISSION DEADLINE: 20th August, 2018

NOTICE OF ACCEPTANCE: 18th September, 2018

FINAL VERSION SUBMISSION DEADLINE: 18th October, 2018

 

Organization Structure

Conference Chairs

General Chair: Shengdong Zhang, Peking University Shenzhen Graduate School, China

Co-chair: Bingde Liu, Shenzhen China Star Optoelectronics Technology Co., Ltd., China

Co-chair: Xiaowei Sun, South University of Science and Technology, China

 

Technical Program Committee

Chair: Kai Wang, Sun Yat-Sen University, China

Co-chair: Ling Li, Institute of Microelectronics, CAS, China 

Byongdeok Choi, Hanyang University, Korea 

Ta-Ya Chu, National Research Council, Canada

Xiaojun Guo, Shanghai Jiao Tong University, China

Yongpan Liu, Tsinghua University, China

Lei Liao, Hunan University, China

Linfeng Lan, South China University of Technology, China

Chuan Liu, Sun Yat-sen University, China

Xifeng Li, Shanghai University, China

Tse Nga (Tina) Ng, University of California, San Diego, USA 

Ahmed Nejim, Silvaco Inc., Cambridge, UK

Dongming Sun, Institute of Metal Research, Chinese Academy of Sciences, China

Radu Sporea, University of Surrey, UK 

Makoto Watanabe, Japan Display Inc., Japan

Man Wong, Hong Kong University of Science and Technology, Hong Kong, China

Qun Zhang, Fudan University, China

 

Steering Committee

Yvan Bonnassieux, Ecole Polytechnique, France

Jamal Deen, McMaster University, Canada 

Xiaojun Guo, Shanghai Jiao Tong University, China

Benjamin Iniguez, Universitat Rovirai Virgili, Spain

Arokia Nathan, University of Cambridge, UK 

Samar Saha, IEEE EDS, Former President, USA

Ravi Todi, IEEE EDS VP of Technical Committees & Meetings, Global Foundries Inc., USA

 

International Advisory Committee

Yvan Bonnassieux, Ecole Polytechnique, France 

Jamal Deen, McMaster University, Canada 

Benjamin Iniguez, Universitat Rovirai Virgili, Spain

Jin Jang, Kyung Hee University, Korea

Ming Liu, Institute of Microelectronics, CAS, China

Yunqi Liu, Institute of Chemistry, CAS, China

Arokia Nathan, University of Cambridge, UK 

K.-T. Tim Cheng, Hong Kong Univ. of Science and Technology, China

 

Local Arrangement Committee

Chair: Hang Zhou, Peking University Shenzhen Graduate School, China

Co-chair: Xugang Guo, South University of Science and Technology, China

Publication Chair: Radu Sporea, University of Surrey, UK

Treasurer: Min Zhang, Peking University Shenzhen Graduate School, China

Sponsorship Chair: Hailong Jiao, Peking University Shenzhen Graduate School, China

Secretory: Jianhua Yan, Peking University Shenzhen Graduate School, China

Publicity Chair: Shuming Chen, South University of Science and Technology, China

 

Design Contest Committee

Chair: Byongdeok Choi Hanyang University, Korea

Co-chair: Di Geng Institute of Microelectronics, CAS, China

Co-chair: Congwei Liao, Peking University Shenzhen Graduate School, China

 

Contact Us:

TEL:020-39943530

MP:18927527035

Email:cadtft2018@chinatft.org

Organized by:

Co-organized by:





Financial Sponsors:





















© Copyright 2016 All Rights Reserved 沪ICP备14001494号-8