机构名录

您的位置: > 首页 > 机构名录 > ARMOR SAS TT Industrial & Expertise Centre

ARMOR SAS TT Industrial & Expertise Centre

发布时间:2018-07-02 访问次数:1678次 分享:

A new dynamism for a long term vision

2018

Creation of ARMOR Colombia and ARMOR Turkey (sales and slitting subsidiaries)

2017

inkanto launching : the new brand of ARMOR thermal transfer ribbon offer

Consolidation and investments for tomorrow

2017

Creation of ARMOR Canada (sales and slitting subsidiary)

2016

New high speed coating machine (MGV3)

2014-2016

50 million € investments

2012

ARMOR gets TMLI LIFE certification for their efforts in Sustainable Development

Move further more to innovation, being Eco-Responsible

2009

Launch of the Solfree process, the 1st 100% solvent-free production process

2008

Signature of the Global Compact and Responsible Care charter

2008

Launch of the Sustainable Development programmes DECAPLAN

2007

Triple QSE certification: ISO 9001 (Quality), ISO 14001 (Environment) and OHSAS 18001 (Health & Safety)

2006

Opening of Thermal Transfer Industrial Expertise Centre in La Chevrolière, near Nantes, France

Our first slitting subsidiaries... the Group expands internationally

2004

Creation of ARMOR China

1999

Creation of the first slitting subsidiaries out of Europe : ARMOR USA and ARMOR ASIA

Birth of Thermal Transfer for industrial printing

1995

ISO 9002 certification formalizes the effort and investment made in pursuit of Quality

1990

Opening of new factory at La Chevrolière near Nantes

1983

ARMOR is the first company to introduce Thermal Transfer technology into Europe

Origins: carbon paper

1964

First company to produce carbon films in France

1925

Creation of the ARMOR brand

1922

Creation of GALLAND & BROCHARD company in Nantes, France

科创项目库

更多>>
  • 高功率半导体激光芯片

    项目简介:真正实现高功率半导体激光芯片的国产化。

  • 新型智能气体传感器检测芯片

    项目简介:集成式智能气体传感器检测芯片产品及解决方案供应商

  • 新型电荷量化型模数转换器

    项目简介:定位于中高端模拟芯片市场,与传统模数转换器相比,该结构数模转换器采用创新型设计,内部不采用比较器,电压越低越有优势,设计难度小,流片成功率很高,同时面积较小。

  • 低功耗宽带无线通信收发器

    项目简介:该芯片是高性能无线射频模拟通信芯片归属于上述的射频模拟芯片的一个分支,主要是给各种高性能通信设备提供无线通信的核心芯片,包括手机4G,4.5G以及未来5G 等室内基站和室外宏基站的核心通信芯片,无人机的高性能无线图传芯片也是一个可能的市场方向。